Solder Paste (SMT Grade, SAC305)
Our SAC305 solder paste is formulated for consistent stencil printing and reliable reflow soldering in SMT assembly lines. Controlled metal content and particle size give clean paste release, low slump, and minimal solder balling — suited to fine-pitch components and mixed-technology boards.
| Alloy | Sn96.5 / Ag3.0 / Cu0.5 (SAC305) |
|---|---|
| Melting Range | 217°C – 220°C |
| Metal Content | 88% – 90% |
| Particle Size | Type 3 / Type 4 |
| Packing | 500g jars, syringes on request |